GD900 THERMAL PASTE

High-quality heat sink paste with thermal conductivity up to 4.8W/mK. The thermal paste is designed to ensure better heat transfer between the heat source – electronic component and its heat sink. It fills the unevenness between the surface of the heat sink and the surface of the cooled component and thus increases the heat transfer to the heat sink, which then has greater cooling efficiency. By using a heat-conductive paste, you will improve the overall cooling efficiency and extend the life of the cooled components. Suitable for all semiconductors (LEDs), processors, graphics cards, memory modules, and more. The paste is not electrically conductive.
Thermal conductivity: 4.8W/mK
Minimum operating temperature: -50°C
Maximum operating temperature: 200°C

What delivering methods are available?

You can collect the item at your door step or you can also collet it by yourself from our showroom.

What is your Delivery presider?

All orders for in-stock items are processed and will be dispatch within 1 to 5 business days. If you place an order in Friday it will get ready in the same day but it will get ready to deliver on Monday (due to currier service consider Saturday and Sunday and poya day as holidays)

Delivery will take up to 2-5 working days but a slight delay can occur depend on the distance and other issues related to weather, transport, covid pandemic etc.

The products will be delivered to you to the address that you provided during the order process.

All the products will be packed and delivered in standard packaging to ensure the safety and to minimizing the damages during the transportation.

We work with leading Currier service providers to ensure a reliable and an expedited service.